Gigabyte X670E AORUS XTREME DDR5 AMD AM5 E-ATX Motherboard

Specification

AMD Ryzen 7000 Series Processors for AMD socket AM5 are supported by the Gigabyte X670E AORUS XTREME Motherboard. With a straight 18+2+2 Phases Digital VRM Solution, it can give performance that is unmatched. The 4x SMD DIMMs in the Gigabyte X670E AORUS XTREME support AMD EXPO and Intel XMP memory modules. It is compatible with DDR5 memory modules with speeds of 6600(OC), 6400(OC), 6200(OC), 6000(OC), 5600(OC), 5200, 4800, and 4400 MT/s. For next-generation storage, it has 4x PCIe 5.0 x4 M.2 Connectors. In order to guarantee VRM power stability and 25110 PCIe 5.0 M.2 SSD performance, it has a Fins-Array III and M.2 Thermal Guard III. By adopting Extended Irregular fins to completely fill every available space and significantly increase surface area, the next generation Fins-Array III provides the highest level of thermal performance. The surface area of a Fins-Array III heatsink is equivalent to two full-size ATX motherboard PCBs, which greatly improves thermal efficiency and heat exchange performance. Additionally, it includes M.2 Connectors with Quick Release & Screwless Design as well as SMD PCIe 5.0 x16 Slot. To minimize throttling and bottlenecking that the high-speed/large capacity of PCIe 5.0 M.2 SSDs may cause, especially under a heavy workload, M.2 Thermal Guard III is built with a 9X enhanced heat dissipation surface. The in-chassis air flow is further improved and the heat convection is optimized by the unique design of the heatsink grooves that face the CPU. The newest Wireless technology, 802.11b, is included in the Gigabyte X670E AORUS XTREME Motherboard. A new dedicated 6GHz band in 11ax Wi-Fi 6E allows for gigabit wireless performance, seamless video streaming, improved gaming, fewer dropped connections, and speeds up to 2.4Gbps. Additionally, Bluetooth 5 offers a 4X greater range than Bluetooth 4.2 and quicker communication. Three years of warranty are included with the Gigabyte X670E AORUS XTREME.